With the continuous progress of science and technology, semiconductor wafer as a core part of modern electronics industry, its processing technology and material preparation technology are increasingly concerned.

The preparation process and method of key semiconductor wafer fabrication materials such as photoresist, polishing liquid and lead zirconate titanate are discussed in this paper.

The important role and technical highlights of Boyee grinding and dispersing equipment in the process of preparation of these materials are emphasized.

01

The preparation process of key semiconductor materials is briefly described

Photoresist paste: The preparation of photoresist paste is a process involving complex chemical reactions and fine process control.

First, according to the preset formula, raw materials such as pigments, dispersants, and solvents are mixed to form a preliminary mixture.

The mixture is then placed in a Boyee sander, where it is ground and dispersed so that the particles achieve the desired particle size distribution.

Under strictly controlled temperature and stirring conditions, the chemical reaction is carried out to ensure that each component reacts fully to form a uniform photoresist solution.

In order to further optimize particle fineness and dispersion, the mixture is also homogenized by high-pressure microjets.

After that, the slurry after grinding and homogenously dispersing is filtered through the filter element to remove contaminants such as large particles and metal ions to ensure the purity of the photoresist.

The particle size, particle size distribution, uniformity and other factors of the photoresist paste play an important role in the performance of the photoresist and the subsequent process.

In this process, the Boyee sander plays a key role in precisely controlling the mechanical strength.

Effectively prevent secondary damage to particles caused by insufficient mechanical energy which is difficult to disassemble or excessive mechanical energy, so as to ensure narrow particle size distribution and good uniformity of the finished product.

Polishing liquid: The preparation of polishing liquid includes key components such as raw materials, polishing additives, solvents and nano-abrasive particles.

The particle size and shape of polishing liquid abrasives have a crucial influence on the effect of CMP process.

With its patented turbine grinding system, Boyee Sander is able to grind the polishing liquid abrasives down to the nanometer level and produce abrasives with regular shape and good uniformity.

This makes the surface of semiconductor wafers produced by the CMP process more flat and smooth, improving the polishing effect and product quality.

Lead zirconate titanate: The wet grinding process for lead zirconate titanate is a delicate process that begins with a precise mix of high purity lead oxide, zirconia and titanium dioxide.

And together with the appropriate amount of solvent into the sand mill for a long time grinding, to ensure that the fine particle size and uniform distribution of powder.

In this process, the control of grinding time, rotational speed and solvent ratio is crucial.

The impurities are then removed and the powder dried through filtration, washing and drying steps. In order to improve the fluidity and formability of the powder, granulation treatment is also required.

02

Optimize the preparation process to create stable semiconductor crystals

In the process of semiconductor crystal preparation, the precise control of equipment parameters and preparation process is the key to ensure the quality and stability of the final product.

As the industry's leading grinding and dispersion solutions provider, Boyee understands the importance of this.

And actively through technological innovation and service optimization, to help enterprises achieve more stable and efficient semiconductor crystal production.

In addition to the control of equipment parameters, the optimization of the preparation process is also the key to improve the quality of semiconductor crystals.

Photo: We invite you to visit Semicon Taiwan Semiconductor Boyee Booth:13126, September 4-6, 2024

Through in-depth research and practice, Boyee has accumulated rich experience in preparation process optimization.

We not only provide advanced grinding and dispersion equipment for the development of semiconductor wafers, but also according to the specific needs of enterprises, tailor-made personalized preparation solutions and processes to help enterprises effectively improve the overall quality of products.